In connected care news are Aperia Tech, Goodyear, Perforce, Green Hills, Infineon, Cetitec, Everspin, Optronics, Solectrix, HopSkipDrive and Cadillac.
Aperia Technologies and Goodyear Partner on Global Tires-as-a-Service Solution
Aperia Technologies Inc., a leader in tire management solutions, has entered into an exclusive agreement with Goodyear to support its global Tires-as-a-Service (TaaS) solution with the Halo Connect i3™ automatic tire inflator.
TaaS is a subscription-based tire management offering that integrates Goodyear’s premium tires, predictive analytics, and an extensive service network to optimize fleet efficiency and reduce costs. With 95% tire inflation accuracy, Goodyear customers have reported 3% fuel savings and a 50% reduction in breakdowns.
The Halo Connect i3 enhances TaaS with automated tire pressure sensing and remote adjustments, reducing roadside service calls and operating costs. This collaboration strengthens Goodyear’s TaaS expansion in North America and Europe, further advancing tire management technology for medium and heavy-duty truck fleets.
Perforce Report Highlights AI’s Growing Role in Automotive Software Development
Perforce Software’s 2025 State of Automotive Software Development Report reveals an increasing reliance on AI in vehicle design, rising concerns over code complexity, and a renewed focus on safety over security in autonomous and connected vehicles.
Key findings include:
- 49% of respondents cite safety as the top AI-related concern, as AI’s non-deterministic nature presents challenges for functional safety.
- AI is driving autonomous vehicle design for 42% of professionals, with applications in ADAS, infotainment, and LiDAR systems.
- Code complexity remains a major challenge, especially for engineers with less than three years of experience.
- Developers are turning to static analysis tools to ensure compliance with industry standards like MISRA and ISO 21434.
- 71% are adopting ISO/DPAS 8800 for AI functional safety assurance, and the upcoming MISRA C:2025 update will impact 53% of developers.
With AI playing an increasing role in automotive software, the report underscores the need for robust safety frameworks, quality assurance tools, and compliance measures to support the future of autonomous and connected vehicles.
Green Hills, Infineon, and Cetitec Develop Cost-Effective Vehicle I/O Aggregator
Green Hills Software, Infineon Technologies, and Cetitec have collaborated to create a cost-efficient, high-performance I/O aggregator gateway for Ethernet-based vehicle networks using Infineon’s TRAVEO T2G MCU.
Key features:
- Optimized vehicle communication by converting CAN and LIN messages to Ethernet.
- Reduces wiring complexity and allows remote updates without firmware changes.
- Safety-certified µ-velOSity RTOS with MULTI IDE for low-latency performance.
- Cetitec’s middleware supports IEEE1722-ACF, Remote Control Protocol, and edge-node peripherals.
- Infineon TRAVEO T2G MCU ensures high-speed communication and flexible connectivity.
This collaboration enhances zonal vehicle architectures, enabling cost savings, efficiency, and faster production cycles for modern automotive networks.
Everspin Expands High-Reliability MRAM for Extreme Environments
Everspin Technologies has announced the expansion of its PERSYST EMxxLX family with two high-reliability MRAM products, the EM064LX HR and EM128LX HR, designed to operate in extreme temperatures from -40°C to +125°C. These products meet AEC-Q100 Grade 1 standards for automotive applications and cater to industries such as aerospace, defense, and industrial environments.
Key features include:
- Capacities of 64Mb and 128Mb for mission-critical systems.
- Quad SPI Interface for easy integration and compatibility.
- Faster write speeds compared to NOR flash.
- Simple architecture with no erase required for enhanced system utilization.
With the growing demand in space exploration and Low Earth Orbit (LEO) satellite missions, these MRAM solutions offer high-speed performance and durability essential for extreme operating conditions. The products will be available for sampling in June 2025, with full production scheduled for late 2025.
VIA Optronics and Solectrix Announce Strategic Collaboration
Summary: VIA Optronics AG (OTC: VIAOY), a leading interactive display solutions provider, has announced a strategic collaboration with Solectrix GmbH, a full-service provider in embedded electronics. This partnership aims to develop advanced camera and display technologies, as well as embedded vision systems. VIA will focus on camera and interactive display technology, while Solectrix will specialize in electronic control units, embedded systems, and software. By combining their expertise, the companies plan to deliver scalable and robust solutions for industrial automation, security, monitoring, and other high-performance applications.
HopSkipDrive Unveils Four New Initiatives to Strengthen Student Transportation Safety
Summary:
HopSkipDrive has announced four new safety initiatives to enhance its commitment to secure and reliable student transportation. Following its sixth annual Safety Report, which highlighted a 99.7% incident-free ride rate in 2024, the company is introducing CareDriver Trends, providing real-time driver safety insights; an Improved Must be Met Process, refining drop-off protocols; Customized Trauma-Informed Training in partnership with NOVA for support teams; and a Dedicated Rider Support Line, offering direct assistance during rides. These initiatives reinforce HopSkipDrive’s mission to ensure safe, equitable, and accessible transportation for all students.
Cadillac to Feature Dolby Atmos Across Entire 2026 EV Lineup
Dolby Laboratories and General Motors have announced that Dolby Atmos will be available across Cadillac’s entire 2026 electric vehicle lineup, including models like the ESCALADE IQL, LYRIQ-V, and OPTIQ. Select 2025 models will also receive the feature via over-the-air updates.
Dolby Atmos revolutionizes in-car audio by delivering immersive, studio-quality sound, enhancing the driving experience. Cadillac executives emphasize this collaboration as a key innovation in in-car entertainment, aligning with growing consumer demand for high-quality audio. With most top-charting artists releasing music in Dolby Atmos, Cadillac drivers can now enjoy a premium listening experience on the road.
NoMIS Power Extends SiC MOSFET Short-Circuit Withstand Time
NoMIS Power has announced a significant breakthrough in silicon carbide (SiC) MOSFET technology, achieving a short-circuit withstand time (SCWT) of at least 5 µs—double the current industry standard—without negatively impacting on-resistance. This advancement enhances the robustness of SiC power devices, making them more viable for high-power applications such as industrial drives, electric vehicles, and grid systems. By refining its proprietary fabrication process, NoMIS Power enables improved reliability, faster switching frequencies, and better thermal management. CTO Woongje Sung emphasized the importance of this innovation for engineers seeking fault-tolerant, high-performance SiC solutions. With SiC adoption expanding, NoMIS Power’s technology sets a new standard for power electronics, ensuring greater efficiency and resilience in demanding applications.
Longsys introduced the following:
- Industrial DDR5 DIMM – Supported ECC error correction, wide-temperature operation (-40°C to 85°C), and anti-sulfuration, ensuring reliability in industrial environments.
- Industrial PCIe Gen4 SSD – Featured hardware PLP, anti-sulfuration, and LDPC error correction, delivering high-speed performance in AI-driven industrial applications.
- 4TB Industrial SATA SSD – Offered pSLC technology, temperature control, and high endurance, designed for long-duration, high-load operations.
Longsys presented its comprehensive automotive storage portfolio, integrating automotive LPDDR4x, UFS, eMMC, and SPI NAND Flash. These products passed AEC-Q100 Grade 2/3 testing and are IATF 16949-certified, supporting applications such as ADAS, in-vehicle infotainment, and autonomous driving. Key highlights included:
- Automotive LPDDR4x – Delivered 4266Mbps speed, ultra-low power consumption, and won Best-in-Show at electronica 2024.
- XS400 Automotive Surveillance SSD – Supported 24-channel 1080p HD video recording, ideal for commercial fleet vehicles.
PTM Full-Stack Customization: Flexible Solutions for Automotive & Industrial Applications
Longsys’ PTM (Product Technology Manufacturing) full-stack customization business model provides tailor-made storage solutions for industrial and automotive applications.
- Industrial Storage Customization – Addressing form factor limitations in automation, DPU intelligent networking, and industrial computing, Longsys offers custom SSD and DIMM configurations optimized for specific hardware structures, firmware, and environmental conditions.
- Automotive Storage Customization – Supporting long product lifecycles and stringent automotive-grade requirements, Longsys operates its own in-house packaging and testing facilities to deliver highly reliable, application-specific automotive storage solutions.
With in-house manufacturing and testing centers in Suzhou, South America, and Zhongshan, Longsys ensured a stable, high-quality supply chain. Longsys continues to strengthen its presence in high-reliability storage solutions.
Title: InPsytech Joins Intel Foundry Accelerator IP Alliance to Advance Semiconductor Innovation
InPsytech, Inc., a leader in high-performance semiconductor intellectual property (IP) solutions under Egis Group, has joined the Intel Foundry Accelerator IP Alliance. This collaboration will integrate InPsytech’s advanced IP offerings into Intel Foundry’s cutting-edge process technologies, providing mutual customers with powerful tools for semiconductor design. By participating in the program, InPsytech strengthens its role in the semiconductor industry, expanding access to its high-speed interface IPs for applications in AI, machine learning, high-performance computing, and automotive electronics.
Through this alliance, InPsytech offers a range of IP solutions, including UCIe, LPDDR5X, DDR4/5, and MIPI interfaces, enabling high-speed data transfer and efficient communication in modern semiconductor devices. These technologies, optimized for Intel Foundry’s advanced process nodes, will help customers enhance design capabilities, reduce development time, and improve product reliability. CEO Alex Wang emphasized that this partnership represents a milestone for InPsytech, providing customers with next-generation IP solutions tailored for Intel’s foundry ecosystem.
Intel Foundry’s VP & GM of Ecosystem Technology Office, Suk Lee, highlighted the importance of InPsytech’s contributions, particularly in high-performance computing, AI, and automotive applications. The Intel Foundry Accelerator IP Alliance fosters collaboration between Intel and its ecosystem partners, streamlining design processes and accelerating time-to-market for innovative semiconductor products. InPsytech’s participation reinforces its commitment to delivering cutting-edge IP solutions, helping semiconductor designers worldwide achieve greater efficiency and innovation.
Mercedes-Benz Partners with FYI for Interactive AI-Driven In-Car Entertainment
Mercedes-Benz has teamed up with FYI, an AI-powered platform founded by will.i.am, to integrate the innovative FYI RAiDiO into its vehicles. This AI-infused, interactive radio platform offers hyper-personalized music, news, and cultural content through AI voice characters known as “Personas.” The platform features 16 interactive stations, with more launching in 2025. This collaboration enhances the in-car entertainment experience, allowing customers to interact with AI hosts and receive real-time information. The rollout begins with a Beta Program in the U.S. for eligible 2024 or newer Mercedes models, including the CLA, E-Class, CLE, C-Class, and GLC.