Connected Car News: Renesas, Car Connectivity Consortium, VicOne, WEG, Ansys, Winbond, AGL, Toyota, ThunderSoft & HERE

In connected car news are Renesas, Car Connectivity Consortium, VicOne, WEG, Ansys, Winbond, AGL, Toyota, ThunderSoft & HERE.

Renesas R-Car X5H

Renesas Electronics has introduced the R-Car X5H, the first in its fifth-generation automotive SoC series, designed to support multiple domains like ADAS, infotainment, and gateway applications in a single chip.

Built on advanced 3nm technology, the R-Car X5H offers high performance with reduced power consumption, enabling OEMs to shift to centralized ECUs for streamlined vehicle development. It features a powerful CPU, AI acceleration, and GPU capabilities, along with chiplet extensions for performance scalability.

The SoC includes hardware-based isolation for secure multi-domain functionality, ideal for Software-Defined Vehicles (SDVs). Renesas also launched the R-Car Open Access (RoX) platform, a comprehensive development environment for automotive software. The R-Car X5H will be available for sampling in early 2025.

Renesas AnalogPAK ICs

Renesas Electronics has rolled out new AnalogPAK™ ICs, including low-power and automotive-grade options, and the industry’s first programmable 14-bit SAR ADC. Part of the GreenPAK™ family, these cost-efficient, NVM-programmable devices combine analog and digital functionality, enabling developers to integrate essential system functions while reducing component count, board space, and power draw.

The star of the release, the SLG47011, offers configurable analog features, including a 14-bit SAR ADC with a programmable gain amplifier, designed to either support or offload microcontrollers (MCUs). It’s packed with features like an analog temperature sensor, I2C and SPI interfaces, and user-defined power-saving modes. Ideal for applications from consumer electronics to automotive, it handles measurement, data processing, and logic control.

The SLG47011, alongside two new low-cost AnalogPAK models (SLG47001/3) and the automotive-focused SLG47004-A, will be demonstrated at electronica in Munich. The full range is now available through Renesas and authorized distributors.

CCC Milestones in 2024

In 2024, the Car Connectivity Consortium (CCC) marked significant progress in its mission to improve vehicle-to-device connectivity, notably expanding membership to over 300 organizations, strengthening the CCC Digital Key™ Certification Program, and building its presence in Asia-Pacific. The CCC, an organization of automakers, tech companies, and device manufacturers, aims to enhance consumer experience by enabling seamless interaction between vehicles and devices.

Key 2024 milestones include:

– Membership Growth: Surpassed 300 members, expanding influence and capacity for developing global solutions.
– Digital Key™ Certification: Certified the first two digital key products, with plans to expand certification to Bluetooth Low Energy (BLE) and ultra-wideband (UWB) technologies in early 2025.
– APAC Expansion: Appointed Zoe Fan as APAC Director to strengthen ties with key automotive and tech companies in the region.
– Event Participation: Promoted the CCC Digital Key™ at events like MOVE America and Mobile World Congress, emphasizing the need for universal standards to increase consumer adoption and trust.
– Interoperability Testing: Held a Plugfest in San Jose, CA, focusing on UWB and BLE interoperability, with a follow-up event scheduled in Munich.

CCC leaders emphasize the importance of universal standards and collaboration to address consumer concerns around usability and trust in vehicle connectivity.

VicOne Partners with Samsung Semi

VicOne, an automotive cybersecurity leader, has partnered with Samsung Semiconductor to advance cybersecurity for Software Defined Vehicles (SDVs). This collaboration leverages VicOne’s xCarbon™ intrusion detection and prevention system (IDPS) with Samsung’s Exynos Auto V920 chip, aimed at providing robust real-time cyber protection for SDVs.

Key highlights of the partnership include:

1. Advanced Pre-Integration: VicOne’s xCarbon™ IDPS integrates seamlessly with Samsung’s V920 chip, utilizing its neural processing unit for real-time threat detection.
2. Enhanced Threat Intelligence: Together, the companies will develop models to analyze data from SDV sensors and ECUs, helping Vehicle Security Operation Centers (VSOC) quickly identify and respond to cyber threats.
3. Dynamic Adaptability: Machine learning algorithms on the V920 enable the system to evolve with emerging threats, updating SDVs in real-time.

VicOne will showcase this collaboration at Munich’s electronica trade fair in November 2024 and at CES 2025 in Las Vegas, alongside a secure In-Vehicle Infotainment (IVI) environment for Android Automotive OS. CEO Max Cheng emphasized this partnership’s role in setting new SDV security standards for OEMs and enhancing consumer safety.

WEG & Snsys Partner for Axial Flux Motor

WEG, a global electrical technology leader, partnered with Ansys to develop the W80 AXgen, a revolutionary axial flux industrial motor for OEM applications like air compressors, water pumps, and generators. Axial flux motors, optimized for higher power density and torque, offer benefits like weight and space savings, improved efficiency, and enhanced durability. Using Ansys’ advanced simulation tools, WEG reduced a motor’s weight from 1,498 kg to as low as 51 kg, cutting material use, logistics costs, and CO2 emissions, thus promoting sustainability.

Ansys simulation tools, including Fluent for fluid simulation, Electronics for magnet and rotor analysis, Mechanical for stress testing, and Granta for materials selection, were pivotal in achieving WEG’s goals. WEG’s R&D manager highlighted Ansys’ simulation capabilities as central to the motor’s development, allowing for extensive virtual testing and reliability. The W80 AXgen motor is available in power ranges from 5.5 kW to 440 kW with a stackable configuration. Ansys’ CTO emphasized that this partnership showcases how advanced materials and simulation technology drive innovation in efficient and resilient product design.

Winbond Intros DRAM Memories

Winbond Electronics Corporation has introduced enhanced LPDDR4/4X DRAM memory solutions, specifically designed for automotive applications, with a focus on power efficiency, performance, and sustainability. These fourth-generation low-power DRAMs offer energy savings while maintaining high performance, making them ideal for electric and hybrid vehicles. They support critical automotive systems, such as advanced driver-assistance (ADAS) and in-vehicle infotainment, with rapid data transfer enabled by high bandwidth and low latency.

One key innovation is the compact 100BGA package, which is 50% smaller than the traditional 200BGA, leading to a proportional reduction in packaging-related carbon emissions. This package is backward-compatible with the 200BGA, allowing manufacturers to easily transition to the new solution without extensive rework. Winbond also guarantees supply chain stability for these DRAM products, ensuring long-term support for automotive and industrial applications that require extended product lifecycles.

Key benefits of Winbond’s LPDDR4/4X DRAM include:
– Power Efficiency: Lower power consumption extends battery life and reduces heat generation in EVs.
– High Performance: High bandwidth and low latency support real-time processing.
– Sustainability: Smaller packaging reduces carbon emissions.
– Design Flexibility: Backward-compatible packaging simplifies integration.
– Supply Chain Reliability: Ensured stable supply for long-lifecycle applications.
– Enhanced Reliability: Built-in ECC improves error correction and memory reliability.

Winbond’s LPDDR4/4X DRAM aligns with the industry’s sustainability goals and meets the evolving demands of the automotive sector for energy-efficient, high-performance memory solutions.

AGL OSPO Expert Group Led by Toyota

Automotive Grade Linux (AGL), an industry collaboration creating an open-source platform for Software-Defined Vehicles (SDVs), has launched an Open Source Program Office (OSPO) Expert Group, led by Toyota. This group aims to promote the establishment of OSPOs in the automotive sector, fostering collaboration and best practice sharing among automakers. Open source software is becoming increasingly important in automotive technology, used by companies like Toyota and Subaru for applications like infotainment, R&D, and fleet management.

The rise of SDVs has encouraged automakers not only to use but also to contribute back to the open-source community, a shift supported by the formation of OSPOs within companies like Toyota, Honda, and Volvo. The AGL OSPO Expert Group, with additional support from Panasonic and AISIN Corporation, provides a neutral space for automakers to share challenges, exchange insights, and develop solutions. Its goals include encouraging OSPO creation, facilitating open-source code contributions, and promoting open discussions on industry-specific issues, such as navigating regulatory restrictions. The group meets biweekly and is open to broader participation.

Mecanica Scientific Services Corporation Joins Geotab Market

Mecanica Scientific Services Corporation, a crash reconstruction and engineering services provider, has joined the Geotab Marketplace as an authorized partner. Through this partnership, Mecanica offers Geotab customers forensically sound data preservation, reporting, analysis, and expert witness services. Mecanica’s expertise will help Geotab clients securely preserve data to support legal and insurance claims.

With headquarters in Oxnard, CA, and additional offices in California, Oregon, and Mexico, Mecanica has grown since its founding in 2014 to a team of 27, serving clients across North America. Geotab views the partnership as a commitment to enhancing driver safety and providing high-impact solutions for customers.

ThunderSoft & HERE Partner

ThunderSoft, a global OS and intelligent device technology provider, and HERE Technologies, a leader in location data platforms, announced a strategic partnership to advance intelligent navigation and high-definition mapping solutions. The collaboration integrates ThunderSoft’s Aqua Drive OS with HERE’s location services, including HD maps and autonomous driving tools, to support developers and automotive manufacturers in creating smarter navigation systems.

Key initiatives include developing AI-powered, globally adaptable navigation platforms and immersive 3D mapping solutions by combining HERE’s map data with ThunderSoft’s Kanzi Map engine. The partnership aims to enhance the mobility ecosystem by delivering personalized, efficient navigation experiences and accelerating innovation in the automotive sector.

Audi Digital Key for Samsung Wallet Coming

Samsung Electronics announced the integration of Digital Key functionality for select Audi vehicles into Samsung Wallet, enabling Galaxy smartphone users to lock, unlock, and start their cars without a physical key. Powered by ultra-wideband (UWB) technology, the Digital Key ensures precise operation and robust security, meeting EAL6+ standards. Users can share or revoke access to the key securely and remotely manage it via Samsung Find if the device is lost or stolen.

Samsung Wallet, introduced in 2022, consolidates payment methods, IDs, and digital keys into a single, secure platform protected by Samsung Knox. The feature will debut in Europe for select Audi models this month, with a global rollout planned.

Europe, the feature will expand globally with Audi’s future rollout plans.