In connected car news this week were Delphi, Cree, Fair, Valens, Fairview Microwave, Ampcera and Lattice Semi
Delphi Tech & Cree
Delphi Technologies PLC , and Cree, Inc., a leader in silicon carbide semiconductors, announce a partnership to utilize silicon carbide semiconductor device technology to enable faster, smaller, lighter and more powerful electronic systems for future electric vehicles (EV).
Cree’s silicon carbide-based MOSFET (metal–oxide–semiconductor field-effect transistor) technology coupled with Delphi Technologies’ traction drive inverters, DC/DC converters and chargers will extend driving range and deliver faster charging times of EVs, while also lowering weight, conserving space and reducing cost. The Cree silicon carbide MOSFETs will initially be used in Delphi Technologies’ 800 Volt inverters for a premium global automaker. Production will ramp in 2022//
With the smart device integrated access solution CoSmA, which will be available to buyers of a Honda e, the technology company Continental demonstrates, what digitalization in the automotive industry looks like. In addition to the car key, buyers of a new Honda e will receive a virtual key onto their smartphone. Using the My Honda+ App, they can unlock the vehicle remotely via Bluetooth Low Energy (BLE). The new Honda e will be available from 2020 onwards in Europe.
Delphi SiC
Delphi Technologies is the first in the industry with volume production of a 800 V silicon carbide (SiC) inverter, one of the key components of highly efficient next-generation electric and hybrid vehicles. The new inverter enables electrical systems up to 800 volts, significantly extending electric vehicle (EV) range and halving charging times compared with today’s state-of-the-art 400 volt systems.
The technology, which supports multi voltage platforms, is an evolution of the company’s proven high-voltage inverter and builds on 25 years of vehicle electrification experience. Delphi Technologies 800 V inverter uses state-of-the-art silicon carbide MOSFET semiconductors (silicon carbide-based metal–oxide–semiconductor field-effect transistor wide bandgap technology). The company recently secured a landmark $2.7bn customer win for volume production of this technology over eight years with a premier global OEM. Launch is expected in 2022, initially for a high-performance vehicle operating at up to 800 Volts.
Fair Buys Canvas from Ford
Vehicle subscription app Fair today announced that it will acquire the assets of Canvas, a vehicle subscription service and wholly owned subsidiary of Ford Motor Credit. The agreement furthers Fair’s leadership position in the vehicle subscription category, enabling the company to continue to accelerate consumer adoption and expansion throughout the U.S. Terms of the sale are private.
Fair is an app-based vehicle subscription model that went live in August 2017 and puts the entire end-to-end process of getting a car on a customer’s phone. Users can shop for a pre-owned car by all-in monthly payments they can afford, sign for the one they want with their finger, and drive it for as long as they want.
5G Peachtree Corners
The City of Peachtree Corners is celebrating the grand opening of Curiosity Lab at Peachtree Corners – the nation’s first intelligent mobility and smart city living laboratory powered by cutting-edge infrastructure and Sprint’s True Mobile 5G– where companies will prove out Internet of Things (IoT/connected device) applications and technologies that will change the way people live and the way businesses operate in the near future.
New Valens Chipset
Valens, the leader in ultra-high-speed in-vehicle connectivity, has unveiled its latest automotive chipset – the VA608A. The VA608A chipset provides the high-speed bandwidth and resilience required for the many applications in the connected and autonomous car, guaranteeing a flexible and future-proof architecture. The chipset delivers data transmission speeds of up to 16Gbps and enables automakers to extend native PCIe as a long-distance in-vehicle connectivity technology – up to 15m/50ft. The VA608A is also the first and only chipset to enable 2.5Gb Ethernet over a single Unshielded Twisted Pair (UTP) wire with near-zero latency.
With the VA608A, Valens is introducing an innovative concept for long-distance PCIe connectivity, enabling OEMs and Tier-1s to utilize a wide array of existing components without requiring a complete redesign of the vehicle’s architecture. This leads to reduced costs and wiring complexity, and the ability to utilize more powerful technologies with increased speed and functionality. Valens’ PCIe extension technology is designed for many use cases in the vehicle including telematics, multi-modem smart antennas (5G, WiFi, WiGig, BT, etc.), ECU-to-ECU connectivity, and shared storage/black box storage. It also significantly simplifies high-speed, low latency, power-efficient backbone architecture.
Fairview Microwave & Infinite Electronics New Adapters
Fairview Microwave Inc., an Infinite Electronics brand and a leading provider of on-demand RF, microwave, and millimeter wave components, has introduced a new series of waveguide to coax adapters that are ideal for use in 5G, telecommunications, satellite communications, point-to-point radio, automotive radar and terrestrial communications applications.
Fairview’s new line of waveguide to coax adapters consists of 50 models with aluminum construction for reduced weight and compatibility with existing aluminum systems. They support frequency ranges from 1.7 to 26.5 GHz and are MIL-DTL-22641-compliant in terms of their electrical performance and mechanical dimensions. These new waveguide to coax adapters are available in 14 different waveguide sizes ranging from WR-42 to WR-430, in addition to UG square/round cover, CMR and CPR flange types. Plus, they are offered in SMA female, N-Type female and 2.92mm female connectorized designs, as well as end launch connector configurations.
Ampcera Roll-to-Roll Solid-State
The Battery Show North America 2019, Ampcera Inc. today announced its new patent-pending roll-to-roll manufacturing technology for solid-state electrolytes used in higher energy density and safer solid-state batteries for electric vehicles and other applications.
The new roll-to-roll manufacturing technology allows continuous production of flexible solid-state electrolyte membranes, which can be directly integrated into solid-state lithium batteries with minimal changes to the industry standard production. The flexible solid-state electrolyte membranes produced by this technology are made of Ampcera’s proprietary solid-state electrolyte composites, and have a reported thickness of 50 microns or thinner and a room temperature lithium ionic conductivity of 0.5 mS/cm. This innovative manufacturing technology enables the development of solid-state lithium batteries with high energy density (>400Wh/kg), low cost (<$100/kWh) and inherent safety advantages. Lithium batteries incorporating the solid-state electrolyte membranes produced by this new manufacturing technology would allow battery manufacturers to meet ever-demanding automotive requirements for safety, energy density, range and cost.
Lattice FPGA
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the company’s attendance at the Operational Safe Systems Conference. Lattice will exhibit its automotive-grade FPGA-based solutions, with a specific focus on enabling functional safety in automotive designs.
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