In connected car news this week were Toyota, Iteris, DENSO, Cypress Semi, MAXIM, Actility, Audi and HERE
TMC Absorbss IC & Toyota Motor Copany Asbosres ITC U.S.A
Toyota Motor Corporation (TMC) is to absorb the research and development functions of its wholly owned subsidiary, Toyota InfoTechnology Center (ITC Japan) into its in-house Connected Company by March 2019. It also plans to absorb the research and development functions of Toyota InfoTechnology Center, U.S.A. (ITC U.S.A.), a wholly owned subsidiary of ITC Japan, into Toyota Motor North America (TMNA).
As the development of automated driving technologies and the roll-out of businesses related to mobility services continues to gain momentum, this decision fits with TMC’s drive to speed up the development and application of ever-better services based on connected technologies to meet the needs of customers more closely.
New Contracts for Iteris
Iteris, Inc. the global leader in applied informatics for transportation and agriculture, today announced two new contracts for its commercial vehicle operations (CVO) platform, which provides software-as-a-service (SaaS) solutions for commercial vehicle inspection, enforcement and data aggregation.
With the recent selection by South Carolina, Iteris added two more states to the Iteris CVO platform in the first half of calendar year 2018. This brings the total number of deployments of Iteris’ roadside inspection solutions to 22 states.
Iteris Inspect™, fueled by CVIEW-Plus™ data services, aggregates and automates the roadside inspection form process, saving commercial vehicle operators and inspectors up to 50% of the time spent conducting commercial vehicle inspections. This also results in less time roadside for law enforcement personnel, which helps to improve safety for police officers, as well as benefiting the safety and mobility for the broader transportation networks.
DENSO Joins HDBaseT Aliiance
The HDBaseT Alliance, the cross-industry group tasked with promoting and advancing the HDBaseT standard, is pleased to welcome DENSO, a leading supplier of advanced automotive technology, as a Contributor member. DENSO joins several other companies in the automotive sector who are playing an important role in defining the requirements for the connected and autonomous car.
The HDBaseT Alliance, with more than 200 members today, advances and promotes HDBaseT as the standard for wired connectivity, both for the professional audio-visual and automotive sectors. HDBaseT Automotive enables the transmission of multi-Gigabit bandwidth of video, audio, Ethernet, controls, data, USB and power over a single unshielded twisted pair.
DENSO Parnters with Plug and Play
Cypress Combo Chips in Pioneer Apple CarPlay Recievers
Cypress Semiconductor Corp. the embedded solutions leader, announced that Pioneer Corporation has integrated Cypress’ Wi-Fi and Bluetooth Combo solution into its flagship in-dash navigation AV receiver. The solution enables passengers to display and use their smartphone’s apps on the receiver’s screen via Apple CarPlay™ or Android Auto™, which provide the ability to use smartphone voice recognition to search for information or respond to text messages. The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.
The Pioneer AVH-W8400NEX receiver uses Cypress’ CYW89359 combo solution, which includes an advanced coexistence engine that enables optimal performance for dual-band 2.4- and 5-GHz 802.11ac Wi-Fi and dual-mode Bluetooth/Bluetooth Low Energy (BLE) simultaneously for superior multimedia experiences. The CYW89359’s RSDB architecture enables two unique data streams to run at full throughput simultaneously by integrating two complete Wi-Fi subsystems into a single chip. The CYW89359 is fully automotive qualified with AECQ-100 grade-3 validation and is being designed in by numerous top-tier car OEMs and automotive suppliers as a full in-vehicle connectivity solution, supporting infotainment and telematics applications such as smartphone screen-mirroring, content streaming and Bluetooth voice connectivity in car kits.
Immersion Licenses Touch Teck to Toyodenso
Maxim ICs Compatible with Qualcomm
Maxim Integrated Products, Inc. announced that select products from its portfolio work with solutions with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to help carmakers and tier-1 suppliers integrate Maxim’s Automotive Safety Integrity Level (ASIL) solutions using the Qualcomm® Snapdragon™ 820 Automotive Platform for infotainment applications. Maxim’s high-performance solutions are designed to provide the necessary building blocks for next-generation vehicles.
Maxim’s advanced ASIL-rated power management, USB charging, next-generation gigabit multimedia serial link (GMSL) serializer and deserializer (SerDes), remote tuner, and software-defined radio (SDR) technologies are optimized to work with the Snapdragon 820 Automotive Platform. As a result, automakers can now achieve a scalable, comprehensive development platform while also addressing needs of high-performance automotive infotainment systems.
The Snapdragon 820 Automotive Platform is an advanced automotive-grade solution that is custom-built with highly optimized cores designed for heterogeneous computing. It runs on Qualcomm Technologies’ custom-built 64-bit Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. The Snapdragon 820 Automotive Platform is also designed to allow the infotainment system to receive software updates, allowing vehicles to be upgraded with the latest features and differentiation.
Key advantages provided by Maxim’s technology
- Power Management: Provides voltage and power monitoring needed to manage the power at the point of load in each device, which becomes necessary as increasing numbers of control modules, sensors, and actuators are distributed throughout the vehicle
- USB Ports Support: Fast-charge detection supports both hi-speed (480Mbps) and full-speed (12Mbps) USB operation, allowing consumers to recharge their USB devices while driving; Includes short-to-battery and short-to-ground protection
- Next-Generation GMSL SerDes: Supports the high data rate, complex interconnect, and data integrity requirements of future automotive infotainment applications
- Remote Tuner and SDR: Architecture simplifies head unit design while improving radio signal quality and reducing cost, weight, and power consumption
Commentary
- “The Snapdragon 820 Automotive Platform was designed to offer automakers a solution that supports a superior and fast connected experience that consumers expect today,” said Nakul Duggal, vice president of product management, Qualcomm Technologies, Inc. “To have our solutions optimized to work with Maxim’s products is a testament to our commitment to continue offering leading solutions for our customers—both in feature-rich technologies and safety advances.”
- “As the automotive industry continues to see unparalleled growth, it is more important than ever to provide a breadth of tools that can support advanced infotainment functions,” said Randall Wollschlager, vice president of the Automotive Business Unit at Maxim Integrated. “By including our leading-edge technologies in Qualcomm Technologies’ powerful automotive development platform, we are well-positioned to deliver cutting-edge features to drive the industry forward.”
Actility & HERE
Actility is a global leader in LoRaWAN connectivity solutions. LoRaWAN is a low-power wireless protocol for wide area networks that allows devices to communicate with IoT applications over long-range wireless connections and with an extended battery life. Actility powers more than 50 service providers in over 30 countries and enables managed enterprise networks for dedicated vertical IoT solutions. As a result, Actility can enable multi-country geolocation solutions using its LoRaWAN roaming hub and Abeeway, its subsidiary that makes low-power, long-life trackers.
Audi & Huawei
Audi signed a memorandum of understanding for a strategic cooperation with the Chinese information and telecommunications corporation Huawei in Berlin. The agreement forms part of a broad-based partnership between companies in the two countries initiated by Chinese Premier Li Keqiang and German Chancellor Angela Merkel.
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