Qualcomm introduced its first-announced Cellular Vehicle-to-Everything (C-V2X) commercial solution based on 3rd Generation Partnership Project (3GPP) Release 14 specifications for PC5-based direct communications, the Qualcomm C-V2X Reference Design, which will feature the 9150 C-V2X chipset with integrated GNSS capability, and include an application processor running the Intelligent Transportation Systems (ITS) V2X stack and a Hardware Security Module (HSM). Qualcomm is working with PSA, Ford, Audi and SAIC using the specification.
Qualcomm joinsed AT&T, IBM, Nokia, Palo Alto Networks, Symantec and Trustonic as part of the IoT Cybersecurity Alliance formed earlier this year.
Qualcomm and Himax Technologies, jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.
Qualcomm V2X with PSA, Ford & Audi
C-V2X’s overarching technologies encompass two transmission modes of direct communications and network-based communications, which are designed to serve as key features for safety conscious and autonomous driving solutions, while complementing other Advanced Driver Assistance Systems (ADAS) sensors, such as cameras, radar and LIDAR, to provide information about the vehicle’s surroundings, including non-line-of-sight (NLOS) scenarios. C-V2X direct communications is designed to support active safety and helps enhance situational awareness by detecting and exchanging information using low latency transmission in the globally harmonized 5.9 GHz ITS band for Vehicle-to-Vehicle (V2V), Vehicle-to-Infrastructure (V2I) and Vehicle-to-Pedestrian (V2P) scenarios without the need for a Subscriber Identity Module (SIM), cellular subscription or network assistance.
Complementing direct communication transmissions, the network-based communications is designed to utilize the wireless operator’s 4G and emerging 5G wireless networks for Vehicle-to-Network (V2N) and operates over licensed operator spectrum to support telematics, connected infotainment and a growing variety of advanced informational safety use cases. The C-V2X standards include both the global 3GPP specifications at the radio layers and reuse the established service, and application layers, defined by the automotive industry, including the Society of Automotive Engineers (SAE) and European Telecommunications Standards Institute ITS (ETSI-ITS), who utilize investments made by the ITS community allowing for evolution of the upper layers to support new and enhanced capabilities.
Qualcomm Technologies has been engaged with the V2X ecosystem for years. With our IEEE 802.11p-based products and the new addition of the 9150 C-V2X chipset, Qualcomm Technologies’ commitment to supporting safety conscious, connected automotive transportation remains strong. The 9150 C-V2X chipset is designed to offer the industry enhanced V2X capabilities, including extended communication range, improved reliability and NLOS performance to expand support for safety and autonomous driving use cases. With a strong evolution path in 3GPP to 5G New Radio (NR), Qualcomm Technologies continues to invest in the C-V2X roadmap and in delivering new and complementary 5G-NR based C-V2X capabilities.
As C-V2X continues to gain momentum, the automotive industry and broad ecosystem for the technology continues to grow and work together. Auto manufacturers continue to express their global support and commitment in helping drive the commercialization of the technology for enhanced safety, advanced services and new applications in next-generation vehicles.
“Qualcomm Technologies’ anticipated 9150 C-V2X chipset serves as a major milestone in paving the road for 5G and safer autonomous driving,” said Dr. Thomas Müller, head of electrics/electronics, Audi. “As C-V2X continues to serve as an essential ingredient for enhanced safety for next-generation vehicles, Qualcomm Technologies’ 9150 C-V2X chipset will certainly help accelerate the adoption and deployment of C-V2X technologies.”
“Ford is committed to V2X communications and sees it as a critical technology to improve vehicle safety and efficiency,” said Don Butler, executive director, connected vehicle and services, Ford Motor Company. “We welcome Qualcomm Technologies’ cellular-V2X product announcement, as the automotive industry and ecosystem work towards C-V2X implementation, and pave the path to 5G broadband and future operating services.”
“We are pleased to see C‐V2X gaining momentum and broad ecosystem support, and how Qualcomm Technologies has helped the automotive industry make great strides in bringing this to fruition, including the announcement of the 9150 C-V2X chipset,” said Carla Gohin, senior vice president, head of innovation, Groupe PSA. “Groupe PSA is strongly involved in the 5G standardization and trials and has great expectations on 5G as an enabler for the connected and autonomous vehicles. C‐V2X and its strong evolution path to 5G will serve as a key enabler for new mobility services. Groupe PSA will evaluate this technology, with Qualcomm Technologies’ support, to adopt for our cars.”
“SAIC has always attached great importance to the development and application of new technologies. It is actively promoting the commercialization of new energy vehicles and internet-connected vehicles, and the development of autonomous vehicles. As vehicles become increasingly intelligent, it’s critical that our vehicles are equipped with premium-tier technologies to provide seamless communication between the vehicle and the roadway and beyond,” said Dr. Liu Fen, director of intelligent driving, research and advanced technology department, SAIC. “We deem C-V2X technologies as the best choice, and look forward to utilizing these technologies in V2X. We admire the efforts Qualcomm Technologies has made and believe that the planned commercialization of their 9150 C-V2X chipset will accelerate the development of next-generation intelligent and connected vehicles.”
Qalcomm Himax 3D
The Himax collaboration brings together Qualcomm Spectra™ technologies and expertise in computer vision architecture and algorithm with Himax’s complementary technologies in wafer optics, sensing, driver, and module integration capabilities to deliver a fully integrated SLiMTM (Structured Light Module) 3D solution. The SLiMTM is a turn-key 3D camera module that delivers real-time depth sensing and 3D point cloud generation with high resolution and high accuracy performance for indoor and outdoor environments. The SLiMTM is engineered for very low power consumption in a compact, low profile form factor, making the solution ideal for embedded and mobile device integration. Qualcomm Technologies and Himax will commercialize the SLiMTM 3D camera as a total camera system solution for a wide array of markets and industries with mass production targeting in Q1/2018.