At electronica in Germany this week, there are several connected car news announcements and demonstrations from NXP, Autotalks, Daimler, HDBaseT, On Semiconductor, Infinenon Technologies, TI, OSRAM and Fujistu.
Prior to the event a survey from the organization reported :
- 85 percent of Germans want automobiles of the future to recognize when they are being stolen and notify the police themselves.
- A smart car should also be able to find its own parking space (77 percent).
- Service itself using remote diagnostics (73 percent).
- Wwarn other vehicles about hazards (71 percent). That is the result of the electronica Trend Index 2020 survey.
When it comes to their wishes for smart automotive electronics, there are also interesting differences between age groups:
In Germany, for example, having online entertainment available in the car while one is traveling is important to 63 percent of middle-aged consumers (ages 35 to 54). By comparison, those kinds of entertainment features had considerably fewer fans (43 percent) in the 55-plus age group. The situation is similar when asked about innovative drive technology: 71 percent in the middle-aged group (35 to 54) feel it is important for a smart car to have an electrical drive system. But the electric car was not as popular (56 percent) to those in the 55-plus generation.
The international trade fair electronica 2016 this week November 8–11 in Munich give the international electronics industry a chance to exchange ideas and information about the future of connected worlds—and more than 2,800 exhibitors will present innovations.
NXP MCU, DAF Trucks, Choda Wireless
NXP Semiconductors N.V. launched a new automotive radar microcontroller (MCU), the NXP S32R27, that will deliver the features and performance required for making safe, automated driving a reality. NXP is the leading supplier of radar-based ADAS semiconductor solutions. An estimated 50 percent of all car radar modules shipped in 2016 will utilize NXP radar processing and front-end technology.
The NXP S32R27 Radar MCU offers a leap in performance of 4 times over the previous MPC577X products for higher accuracy. NXP’s highly integrated radar MCUs and RF front-end technologies (RFCMOS or BiCMOS) offer customers scalable system solutions that address ultra-short range, short-range, mid-range and long- range radar.
NXP at electronica:
The S32R27 is part of two demonstrations showcased by NXP.
• A miniature Local Motors shuttle bus will feature the S32R27 combined with NXP’s MR3003 SiGe radar transceiver at the NXP booth in Hall A6.
• A second demonstration, showcased in the NXP Smarter World Tour truck, will feature the S32R27 in combination with NXP TEF810x RFCMOS transceiver.
NXP and DAF Trucks will showcase truck platooning in the city of Munich with the inclusion of intelligent traffic lights (Siemens) that automatically adapt traffic signaling based on the truck convoy’s location, thus significantly improving the traffic flow.
Together with Honda, Siemens, Marben, Cohda Wireless and Chemtronics, other live demonstrations in Munich will include secure V2X use cases, such as the detection/warning of motorcycles for improved safety. An autonomous car built by the University of Eindhoven using NXP sensor fusion will also be at the event.
NXP also announced a software agreement with Cohda Wireless, a leading software specialist for secure automotive communication applications. The agreement gives NXP full access to Cohda’s industry leading algorithms for the rapid development of V2X standard enhancements and additional applications.
NXP and Cohda Wireless enable NXP V2X systems to securely communicate important driving information between vehicles for safe decision making.
NXP/Cohda RoadLINK technology is the solution of choice in more than 60 percent of all test vehicles used across the globe in V2X field trials.
Autotalks Talks Chipsets
Autotalks will launch SECTON, the latest addition to its chipset portfolio. V2X solutions, Autotalks’ new secure, cost-optimized, mass-market ready V2X hardware add-on is architected for autonomous vehicles, is flexible and can smoothly fit all customer architectures. SECTON offers simple integration with any external host CPU.
SECTON completely handles V2X security computation, thus making it cost-effective and hassle free, allowing application developers to focus on application reliability rather than vulnerability to Cybersecurity attacks.
SECTON integrates an enhanced-range mobility-optimized IEEE802.11p modem, an ultra-low-latency V2X Hardware Security Module (eHSM) and cryptoagile hardware verification engines. SECTON also supports IEEE 802.11a/b/g/n/ac to enable high-bandwidth external Wi-Fi for supplementary value-added services, like data synchronization with home and high-speed downloads. In addition, it has worldwide compliance, supporting US, EU and Japan standards.
The SECTON chipset will be showcased at Electronica 2016 Valens and Daimler announced their collaboration to bring HDBaseT Automotive into cars in the near future.
Daimler & HDBaseT
Daimler has selected HDBaseT Automotive as the technology of choice to guarantee high performance of advanced infotainment, ADAS, and telematics systems. Valens, as the inventor of HDBaseT and founder of the HDBaseT Alliance, brings the technology and expertise to accomplish the goal of commercializing HDBaseT-enabled vehicles in the near future.
HDBaseT Automotive is the only technology today that enables the tunneling of high-speed video and audio, USB, data, and more, with native networking capabilities over a single unshielded twisted-pair (UTP) cable for up to 15m (50ft). HDBaseT Automotive also allows for daisy-chaining and multistreaming, to simplify and optimize in-vehicle connectivity.
ON Semiconductor Power Module
ON Semiconductor introduced the industry’s most compact 650 volt (V), 50 ampere (A) automotive qualified intelligent power module for controlling vehicle air conditioning (A/C) compressors. The FAM65V05DF1 addresses numerous other high voltage auxiliary motor applications in hybrid and electric vehicles, and helps designers increase the performance and efficiency of applications while simultaneously reducing costs.
The FAM65V05DF1 uniquely integrates IGBTs, freewheeling diodes and gate drivers in an automotive-qualified 12 cm2 footprint package, which is up to 40% smaller than solutions assembled from multiple discrete components. The device greatly simplifies and shortens the process of designing the power stages of high voltage automotive auxiliary inverters for A/C compressors and oil pumps – applications that must comply with stringent performance standards in demanding operating environments and with tight space constraints.
Infineon IoT
At electronica 2016, Infineon Technologies presents semiconductor solutions for sustainable success in the Internet of Things (IoT). Electronics from Infineon are part of our everyday lives already today and even more tomorrow. Sensors, microcontrollers, power semiconductors and security solutions are the building blocks to make connected devices and IoT systems smart, safe and energy-efficient. For example, around 80 per cent of innovation in automotive applications is based on semiconductors.
Premiering at electronica 2016, the Infineon IoT Security Circle places the spotlight on the urgent need for security in the IoT.
On display at the Infineon booth are solutions ranging from connected cars to smart manufacturing to smart homes. And at the dedicated Maker’s Corner, Infineon provides “2GO-Kits”, Arduino shields and other boards, to make new applications up and running in no time.
At electronica 2016 Osram Opto Semiconductors is showcasing a four-channel laser that takes LIDAR systems (Light Detection and Ranging) for autonomous or semi-autonomous driving a step closer. The prototype laser has an extremely short pulse length and four parallel output channels. It therefore offers completely new options for detecting objects and a unique vertical detection zone. This milestone in modern laser technology will be used for the first time in scanning LIDAR sensors based on micro-electromechanical systems (MEMS). Such solutions do not need any mechanism to redirect the laser beam so they are less susceptible to wear and tear. Together with Innoluce, an Infineon Technologies AG company and specialist in laser scanner technology, Osram is showing what the future of LIDAR systems may look like.
LIDAR sensors are an essential element in future fully autonomous or semi-autonomous self-driving cars. The system operates on the principle of time-of-flight measurement. A very short laser pulse is transmitted, hits an object, is reflected and detected by a sensor. From the time-of-flight of the laser beam it is possible to calculate the distance to the object. Scanning LIDAR systems scan the surroundings of the car horizontally with a laser beam across a certain angular segment and produce a high-resolution 3D map of the environment. In most cases, the laser beams in present-day scanning LIDAR systems are deflected by means of mechanical moving mirrors. Some solutions make use of several laser diodes mounted one on top of the other to extend the vertical field of view.
Texas Instruments
At electronica 2016 in Munich, Germany, Texas Instruments (TI) is showcasing innovation focused on the future of industrial automation and automotive technologies, such as the following:
- Visit the industrial demo showcasing TI technology enabling Industry 4.0 and the smart factory of tomorrow leveraging TI solutions for real-time Ethernet with EtherCAT. Take a closer look at sensor communications with wired technologies like IO-Link and wireless technologies such as Bluetooth® low energy, and explore how TI’s gallium nitride (GaN) technology significantly increases the efficiency in variable speed motor drives.
- Discover innovation in automotive all in one car. The Evolution Car 2020 (EvoCar) showcases how TI’s automotive portfolio, including DLP® products, enables advanced driver assistance systems (ADAS), infotainment, haptic feedback and adaptive LED headlights. Come and take a ride.
Fujistu
Fujitsu Electronics Europe will be attending this year’s electronica. Under the slogan “Accelerating Global Innovation“, FEEU informs businesses about the current supplier portfolio and range of product linecards, developed by the value added distribution partner for key sectors such as the automotive, industrial, medical & wellness and telecommunication industries. An additional focus at this year’s electronica will centre on FEEU’s consultancy services. FEEU business experts are able to support customers through the entire product development process – from deployment to production. As a trusted advisor, FEEU supports every phase with technological expertise and industry knowledge.
To showcase a significant subset of its line card FEEU will set up a supplier area at this year’s electronica and a range of suppliers will be in attendance, including:
- Ambiq Micro: Provider of low power MCU’s and low power RTC’s
- FDK Corporation: Supplier of DC/DC power modules and electric components
- Fujitsu Interconnect Technologies (FICT): Producer of PCBs and substrates
- Fujitsu Semiconductor Limited (FSL): Supplier of FRAM solutions
- Hokuriku: Supplier of sensors, modules, piezoelectric transducers, tactile switches, ESD-protection and trim potentiometers
- Mie Fujitsu Semiconductor Limited (MIFS): Expert on foundry services
- Shinko: Supplier of packaging solutions
- Tokyo Electron Devices (TED)/Inrevium: Supplier of FPGA boards and FPGA mezzanine cards (FMCs)
- Transphorm: Specialist for Gallium Nitride (GaN) power devices